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2026-06-16
New Unigroup Group Successfully Holds 2026 Strategy Launch Conference

Three Pillar Industries

Spanning the Entire Value Chain of Semiconductor Chips, ICT Communication Infrastructure, and AI+ Applications

01
semiconductor chip
Covering the widest range of chip categories with China's largest overall sales volume; core technologies built on decades of accumulation, extensively validated, secure and reliable
紫光展锐·紫光国微·紫光国芯·紫光同芯·紫光同创
01
digital ICT infrastructure
We are building an all-encompassing AI infrastructure system that covers cloud, networking, security, computing power, storage, and end devices, delivering full-stack security and autonomous controllability from the hardware layer up to the application layer
紫光股份·新华三·紫光云·紫光恒越·紫光华智
01
AI + Applications
We have established a three-layer capability foundation — base chips, edge AI chips, and AI tools — extending into scenarios such as intelligent computing centers, the low-altitude economy, aerospace, the marine economy, and embodied intelligence
紫光数能·紫光智算·紫光天际·紫光汉图
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Major National Projects

New Unigroup provides comprehensive support for major national projects, including core chips, network infrastructure, cloud services, and digital solutions.

New Unigroup: Intelligent Future

Originating from Tsinghua University, New Unigroup Group traces its roots to the Tsinghua University Science and Technology Development General Corporation established in 1988, and has long been deeply engaged in the technology sector. Revitalized in 2022, the Group has evolved into a globally competitive intelligent technology industrial conglomerate. In response to the new cycle of AI-driven industrial transformation, New Unigroup focuses on three core pillars: semiconductors, ICT digital infrastructure, and artificial intelligence. The Group is committed to leveraging hard-tech innovation and industrialization capabilities to build a world-leading full-chain intelligent technology ecosystem, making the world smarter, more open, more equitable, and better.

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